Features
1. Current: 5-35A
2. Glass passivated diode chips
3. Voltage: 100-1600V
4. High thermal conductive sealing package
5. Small and general purpose size
6. Excellent power to volume ratio
7. Welding technique under the protection of vacuum and hydrogen

Features
1. Non-insolated, baseboard is common electrode
2. International standard capsulation
3. Fully pressure welding structure, good temperature characteristics and power cycling ability.
4. Max. junction temperature up to 140℃
5. High surge current
6. Low forward voltage drop

Features
1. Non-insolated, baseboard is common electrode
2. International standard capsulation
3. Fully pressure welding structure, good temperature characteristics and power cycling ability.
4. Max. junction temperature up to 140℃
5. High surge current
6. Low forward voltage drop

Features
1. Non-insolated, baseboard is common electrode
2. International standard capsulation
3. Fully pressure welding structure, good temperature characteristics and power cycling ability.
4. Max. junction temperature up to 140℃
5. High surge current
6. Low forward voltage drop

Features
1. Non-insolated, baseboard is common electrode
2. International standard capsulation
3. Fully pressure welding structure, good temperature characteristics and power cycling ability.
4. Max. junction temperature up to 140℃
5. High surge current
6. Low forward voltage drop

Features
1. The chip is electrical insulation to the baseplate,2500VAC
2. International standard capsulation
3. Fully pressure welding structure, good temperature characteristics and power cycling ability.
4. If≤350A Air-cooling If≥400A Air-cooling or water-colling
5. Easy in installation and convenient in use and maintenance.
6. Small&light
7. Welding technique under the protection of vacuum and hydrogen

Features
1. The chip is electrical insulation to the baseplate,2500VAC
2. International standard capsulation
3. Fully pressure welding structure, good temperature characteristics and power cycling ability.
4. Max. junction temperature up to 140℃
5. High surge current
6. Low forward voltage drop

Features
1. The chip is electrical insulation to the baseplate,2500VAC
2. International standard capsulation
3. Fully pressure welding structure, good temperature characteristics and power cycling ability.
4. Max. junction temperature up to 140℃
5. High surge current
6. Low forward voltage drop

Features
1. The chip is electrical insulation to the baseplate,2500VAC
2. International standard capsulation
3. Fully pressure welding structure, good temperature characteristics and power cycling ability.
4. If≤350A Air-cooling if≥400A Air-cooling or water-cooling
5. Easy in installation and convenient in use and maintenance.
6. Small & light
7. Welding technique under the protection of vacuum and hydrogen

Features
1. The chip is electrical insulation to the baseplate,2500VAC
2. International standard capsulation
3. Fully pressure welding structure, good temperature characteristics and power cycling ability.
4. If≤350A Air-cooling if≥400A Air-cooling or water-cooling
5. Easy in installation and convenient in use and maintenance.
6. Small & light
7. Welding technique under the protection of vacuum and hydrogen